management of resources.
Experience:
Part II -- Technology
Owner of package related product reliability tests (2001-2004), including pre-conditioning, TC, TS, THB, HAST, PCT, etc.
Owner of wafer level process reliability tests (2004-2005), including:
-- Dielectric related: TDDB, Vramp, Jramp, constant-J and P2ID
-- Device related: HCI and NBTI
-- Interconnection related: Isothermal, SWEAT and Iramp
In a short summary:
Comprehensive in reliability, parametric and functional tests, from the failure mechanism to the test methodology.
Skills:
Implant PDCA and teamwork into everyday work
Fluent in both written and spoken English, and acknowledged outstanding in expression and communication
Familiar with UNIX system, as well as C and BASIC programming
Familiar with Excel macro programming for data analysis
Familiar with statistical concept and tools, good at DOE and analysis by JMP
Contact me if you are interested:
Tel: (0)136********
Email: *******@msn.com or *******@sina.com